
ꯄꯤ.ꯑꯦꯐ.ꯑꯦ.ꯅꯥ ꯂꯥꯏꯟ ꯇꯧꯕꯥ ꯄꯥꯏꯄꯂꯥꯏꯅꯁꯤꯡ .
-80 ꯗꯤꯒ꯭ꯔꯤ ~200 ꯗꯤꯒ꯭ꯔꯤ ꯂꯣ-ꯇꯦꯝꯄꯦꯔꯦꯆꯔ ꯍꯥꯏ-ꯁꯦꯒꯃꯦꯟꯇ ꯇꯧꯔꯕꯥ ꯂꯥꯏꯅꯤꯡꯒꯤ ꯊꯧꯑꯣꯡꯒꯤꯗꯃꯛ ꯗꯤꯖꯥꯏꯟ ꯇꯧꯕꯥ, ꯀꯃꯞꯂꯦꯛꯁ ꯔꯨꯇꯤꯡꯒꯤꯗꯃꯛꯇꯥ ꯆꯨꯅꯕꯥ ꯁꯦꯒꯃꯦꯟꯇ ꯇꯧꯔꯕꯥ ꯂꯥꯏꯅꯤꯡ ꯄ꯭ꯔꯣꯁꯦꯁ; ꯌꯨꯅꯤꯐꯣꯔꯝ ꯀꯝꯄꯣꯅꯦꯟꯇ ꯃꯦꯇꯔꯤꯑꯦꯂꯁꯤꯡ, ꯗꯤꯖꯥꯏꯅꯗꯒꯤ ꯍꯧꯔꯒꯥ ꯏꯅꯁ꯭ꯇꯣꯂꯦꯁꯟ ꯐꯥꯑꯣꯕꯒꯤ ꯃꯄꯨꯡ ꯑꯣꯏꯕꯥ ꯄ꯭ꯔꯣꯁꯦꯁ ꯁꯔꯕꯤꯁꯁꯤꯡ ꯁꯄꯣꯔꯠ ꯇꯧꯕꯥ; ꯚꯥꯏꯕ꯭ꯔꯦꯁꯟ ꯇ꯭ꯔꯥꯟꯁꯃꯤꯁꯟ ꯍꯟꯊꯍꯟꯅꯕꯥ ꯑꯈꯟꯅꯕꯥ ꯕ꯭ꯔꯦꯀꯦꯠꯁꯤꯡꯒꯥ ꯂꯣꯌꯅꯅꯥ ꯁꯦꯃꯒꯠꯄꯥ꯫
- ꯐꯥꯁ꯭ꯠ ꯗꯦꯂꯤꯑꯦꯚꯔꯤ .
- ꯀ꯭ꯕꯥꯂꯤꯇꯤ ꯂꯩꯕꯥ ꯑꯦꯁꯨꯔꯦꯟꯁ
- ꯲꯴/꯷ ꯀꯁ꯭ꯇꯃꯔ ꯁꯔꯕꯤꯁ ꯄꯤꯕꯥ
ꯄꯣꯠꯊꯣꯛ ꯄꯨꯊꯣꯀꯄꯥ .
ꯀꯣꯔ ꯐꯤꯆꯔꯁꯤꯡ .
-80 ꯗꯤꯒ꯭ꯔꯤ ~200 ꯗꯤꯒ꯭ꯔꯤ ꯂꯣ-ꯇꯦꯝꯄꯦꯔꯦꯆꯔ ꯍꯥꯏ-ꯁꯦꯒꯃꯦꯟꯇ ꯇꯧꯔꯕꯥ ꯂꯥꯏꯅꯤꯡꯒꯤ ꯊꯧꯑꯣꯡꯒꯤꯗꯃꯛ ꯗꯤꯖꯥꯏꯟ ꯇꯧꯕꯥ, ꯀꯃꯞꯂꯦꯛꯁ ꯔꯨꯇꯤꯡꯒꯤꯗꯃꯛꯇꯥ ꯆꯨꯅꯕꯥ ꯁꯦꯒꯃꯦꯟꯇ ꯇꯧꯔꯕꯥ ꯂꯥꯏꯅꯤꯡ ꯄ꯭ꯔꯣꯁꯦꯁ; ꯌꯨꯅꯤꯐꯣꯔꯝ ꯀꯝꯄꯣꯅꯦꯟꯇ ꯃꯦꯇꯔꯤꯑꯦꯂꯁꯤꯡ, ꯗꯤꯖꯥꯏꯅꯗꯒꯤ ꯍꯧꯔꯒꯥ ꯏꯅꯁ꯭ꯇꯣꯂꯦꯁꯟ ꯐꯥꯑꯣꯕꯒꯤ ꯃꯄꯨꯡ ꯑꯣꯏꯕꯥ ꯄ꯭ꯔꯣꯁꯦꯁ ꯁꯔꯕꯤꯁꯁꯤꯡ ꯁꯄꯣꯔꯠ ꯇꯧꯕꯥ; ꯚꯥꯏꯕ꯭ꯔꯦꯁꯟ ꯇ꯭ꯔꯥꯟꯁꯃꯤꯁꯟ ꯍꯟꯊꯍꯟꯅꯕꯥ ꯑꯈꯟꯅꯕꯥ ꯕ꯭ꯔꯦꯀꯦꯠꯁꯤꯡꯒꯥ ꯂꯣꯌꯅꯅꯥ ꯁꯦꯃꯒꯠꯄꯥ꯫
ꯀꯣꯔ ꯑꯦꯗꯚꯥꯟꯇꯦꯖꯁꯤꯡ .
ꯁꯦꯃꯤ F57/F58 ꯁ꯭ꯇꯦꯟꯗꯔꯗꯁꯤꯡ, ꯃꯦꯇꯜ ꯑꯥꯏꯑꯣꯟ ꯄ꯭ꯔꯦꯁꯤꯄꯤꯇꯦꯁꯅꯒꯥ ꯃꯥꯟꯅꯩ꯫<1ppb, meeting 12-inch wafer manufacturing needs; provides third-party test reports to eliminate leakage from connections of different brands; supports quick integration for later expansion.
ꯑꯦꯞꯂꯤꯀꯦꯁꯅꯒꯤ ꯁꯤꯅꯥꯔꯤꯑꯣꯁꯤꯡ .
ꯏꯂꯦꯛꯠꯔꯣꯅꯤꯛ ꯐꯦꯛꯇꯔꯤꯁꯤꯡꯗꯥ ꯑꯂꯠꯔꯥꯞꯌꯨꯔ ꯋꯥꯇꯔ ꯁꯤꯁ꯭ꯇꯦꯃꯁꯤꯡ, ꯂꯣ-ꯂꯦꯕꯣꯔꯦꯇꯔꯤꯁꯤꯡꯗꯥ ꯇꯦꯝꯄꯦꯔꯦꯆꯔ ꯃꯦꯗꯤꯌꯝ ꯇ꯭ꯔꯥꯟꯁꯄꯣꯔꯇꯦꯁꯟ, ꯁꯦꯃꯤꯀꯟꯗꯨꯛꯇꯔ ꯐꯣꯇꯣꯔꯦꯁꯤꯁ꯭ꯠ/ꯗꯤꯕꯦꯂꯄꯔ ꯇ꯭ꯔꯥꯟꯁꯃꯤꯁꯟ ꯁꯤꯁ꯭ꯇꯦꯃꯁꯤꯡ꯫
ꯁꯔꯇꯤꯐꯤꯀꯦꯠꯁꯤꯡ ꯄꯤꯕꯥ

ꯄꯨꯊꯣꯀꯄꯒꯤ ꯊꯧꯑꯣꯡ ꯑꯁꯤ .

ꯄꯥꯔꯇꯅꯔꯁꯤꯡꯅꯥ ꯑꯦꯝ.ꯑꯦꯁ.ꯑꯦꯝ.ꯏ.

ꯍꯠ ꯇꯦꯒꯁ: ꯄꯤ.ꯑꯦꯐ.ꯑꯦ.ꯅꯥ ꯂꯥꯏꯟ ꯇꯧꯕꯥ ꯄꯥꯏꯄꯂꯥꯏꯅꯁꯤꯡ, ꯆꯥꯏꯅꯥ ꯄꯤ.ꯑꯦꯐ.ꯑꯦ.ꯅꯥ ꯂꯥꯏꯟ ꯇꯧꯕꯥ ꯄꯥꯏꯄꯂꯥꯏꯅꯁꯤꯡ ꯁꯥꯕꯥ, ꯁꯞꯂꯥꯏꯌꯔꯁꯤꯡ, ꯐꯦꯛꯇꯔꯤ






